When X-rays penetrate matter, a series of extremely complex physical processes occur due to the interaction between the rays and the matter. As a result, the rays are
absorbed and propagated, losing some of their energy and diminishing in intensity accordingly. This is called radiation decay. The essence of X-ray radiation inspection is
based on the difference in radiation energy attenuation between the inspected workpiece and the insufficient internal medium. This difference can lead to a difference in
the intensity of the radiation after it passes through the workpiece, hence the resulting image due to the lack of radiation. It is projected on a photosensitive material (film)
processed in a dark room. After the defect image is obtained, the nature of the defect inside the workpiece and the level of the negative film are evaluated according to the
specification.
For some items that cannot be detected by appearance or that cannot reach the inspection location, X-rays have a strong penetration ability because the density of the
material that the X-rays penetrate is different, and therefore the light intensity is different. X-ray inspection can produce these different light intensities into corresponding
images, and then clearly show the internal structure of the object to be tested, and then complete the target inspection without damaging the object to be tested.
After nearly 100 years of development with the original film X-ray technology, X-ray inspection technology has formed a relatively complete X-ray inspection technology
system, composed of X-ray shooting, X-ray real-time imaging, X-ray.
According to the method of obtaining the workpiece inspection image, the X-ray inspection technology is divided into X-ray shooting inspection technology and data
radiography inspection technology. The development of X-ray photography technology has a long history, mature technology and wide application, which has laid a solid
foundation for the development of other radiography technology. Data X-ray detection technology mainly includes real-time X-ray imaging technology, X-ray block
tomography CT imaging detection technology, X-ray microCT imaging detection technology, X-ray cone-beam CT three-dimensional imaging detection technology.
1. It can be used to detect whether some metal materials and parts, electronic parts or parts, electronic parts or LED parts have cracks, whether there are foreign bodies.
2. Can detect and analyze whether there is internal deviation of BGA, circuit board, etc.
3. It can be used to detect and judge that there is no broken wire and other defects in BGA welding, such as air welding and air welding.
4. It detects and analyzes the internal conditions of cables, plastic parts, microelectronic systems, adhesives and seals.
5. Used to check whether there are bubbles and cracks in porcelain castings.
6. Check whether the IC packaging has defects, such as whether there is layer separation, whether it is broken, whether there is a gap.
7. The application of printing industry is mainly manifested in the paperboard production process without defects, Bridges and short circuits.
8. In SMT, spot welding is usually checked for gaps.
9. In integrated circuits, it is usually checked whether there is short circuit, short circuit or abnormal connection of various connection lines.
We find the scope of X-ray inspection so wide, but when using X-ray inspection, we must also understand the scientific inspection steps.
1. First, determine the type of sample, or the detection location and requirements of the material.
2. Send the sample to the X-ray checkpoint.
3. After inspection, analyze the resulting image.
4. Mark the location and type of problem.
After we have a certain understanding of X-Ray equipment, we will be more targeted when purchasing X-Ray test equipment. Reliable, high quality X-Ray inspection
equipment is your first choice.
